南宫NG28

Cadmium

and its compounds

0.01%

Cadmium and its compounds in electrical contact; Cadmium in filter glass or glass used for reflectance standards; Cadmium in printing ink for the application of enamel on glass; Cadmium alloy as electrical or mechanical solder joint to electrical conductor located directly on voice coil in transducer used in high-powered loudspeaker with sound pressure level of 100 dB (A) or more; Cadmium and cadmium oxide in thick film paste used on aluminium bonded beryllium oxide.

Hexavalent chromium

0.1%

Hexavalent chromium as anticorrosion agent, not exceeding 0.75% by weight, in the cooling solution of carbon steel cooling system in absorption refrigerator.

Lead and its compounds

0.1%

Lead in glass of cathode ray tube; Lead, not exceeding 0.2% by weight, in glass of fluorescent tube; Lead, not exceeding 0.35% by weight, as an alloying element in steel for machining purposes or galvanised steel; Lead, not exceeding 0.4% by weight, as an alloying element in aluminium; Lead, not exceeding 4% by weight, in copper alloy; Lead in high melting temperature type solder (that is, lead-based alloy containing 85% by weight or more lead); Electrical and electronic component containing lead in –– (a) glass or ceramic (other than dielectric ceramic in capacitor); (b) glass or ceramic matrix compound; Lead in dielectric ceramic in capacitor for rated voltage of 125 V AC , 250 V DC or higher; Lead in bearing shell or bush for refrigerant-containing compressor for heating, ventilation, air conditioning or refrigeration application; Lead in white glass for optical application; Lead in filter glass or glass used for reflectance standards; Lead in printing ink for the application of enamel on glass; Lead in solder for –– (a) completing viable electrical connection between semiconductor die and carrier within integrated circuit flip chip package; (b) soldering to machinedthrough hole discoidal or planar array ceramic multilayer capacitor; (c) soldering thin copper wire (with diameter not exceeding 100 μm) in power transformer; Lead in soldering materials in mercury-free flat fluorescent lamp; Lead oxide in surface conduction electron emitter display used in structural element; Lead bound in crystal glass; Lead in cermet-based trimmer potentiometer element; Lead in plating layer of highvoltage diode on base of zinc borate glass body.

Mercury

and its compounds

0.1%

Cold cathode fluorescent lamp or external electrode fluorescent lamp, used for purposes other than general lighting, that –– (a) is not more than 500 mm long and contains not more than 3.5 mg of mercury; (b) is more than 500 mm long but not more than 1500 mm long and contains not more than 5 mg of mercury; or (c) is more than 1500 mm long and contains not more than 13 mg of mercury.

PBBs

0.1%

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PBDEs

0.1%

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